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Alternate Dip®Coater OD-2304-N1-CE	Micro dip®coater MD-0408-N1-CE	Nano dip®coater ND-0407-N1-CE
Linear Dip ® Coater LD-1304-S2	Linear Dip ® Coater With automatic rotation mechanism LD-2404-N1	Desk Top Type dipcoater for Small Size Objects use DT-0303-N1-CE
Portable dip®coater DT-0001-N1	Clean Box Integrated Type DT-1007	Desk Top dipcoater for Middle Size DT-0502-N1
Exact Figure Tolerance dipcoater MD-1405-S1	Desk Top Type dipcoater for Big Size Objects use DT-1508-N1	4-axis control dip coater DT-1609-4D1
dipcoater for Large Size DT-1704	dipcoater for Long Sized Object DT-1303-S1	Tubular dip coater with circulation equipment DT-1903
Large size dip coater DT-1911

Nanoincoater for sleeves (release agent coating device) NIC-2409	NANO IN COATER 4inch NIC-1106	NANO IN COATER 8inch NIC-1103	NANO IN COATER NIC-0809
Gas Replacement Box integrated NANO IN COATER NIC-1109G	NANO IN COATER NIC-1208	Nano-in Coater(Release Agent Application Device) NIC-1410-S1	Nano-in Coater for Rolled Object use (Release Agent Application Device) NIC-1308
Medium Coating Equipment DT-1104	Dip Coat System with Circulation Mechanism for Coating Liquid MD-1501-S1	Washing Equipments SA-1109	Cleaning device with hot water dryer SA-1202
Nano-in Coater (Release Agent Application Device) Rotation-able Tank + with Ultrasonic Cleaning Cist NIC-1510	N2 purge specification linear dip coater LD-1811	Nano incoater for large size (release agent coating device) NIC-2003	Multi-tank (8-tank) dip coater DT-1812
Dip coater for cylindrical base material DT-2002

	Coating Equipment for Hard-Coat Material HC-1004		Full Automatic dipcoater for Pattern Resist Coating FA-0406		Coating Equipment for Printed Circuit Board SA-1210		Dip Coater for the Photo Litho-Coat SA-1407-S1
	Semi-Automatic Dip Coater SA-1503-S1		Semi-Automatic Dip Coater with Turning Mechanism (UL approved equipment) SA-1509UL		Coating liquid saving type dip coater SA-1712		Cleaning device with ultrasonic waves for glass materials SA-1801

Information

ESEC embedded system development technology exhibition　(2009/05/16)

Our manufacturing PCB was exhibited to the 12th time of ESEC embedded system development technology exhibition. (Tokyo Big Site)

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In order to make quality improvements, we may have the design changing without prior notice. Please cooperate to understand.