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NANO IN COATER (Equipments for Mold Release Agent Coating) NIC-1106
Small lot production / release agent application device specifications /
This is the Equipment to fix Mold Release Agents on the surface of the working object through the treatments by the process of Coating Mold Release Agent on the 4 inches Wafer Board, then Rinse Washing and Fixation Drying. Those Treatments are done by every Working Object. This is the dipcoater Type Equipment which is reflected by SDI's techniques about Dip Coat (Dip Coating).
| Main Specifications | |
|---|---|
| Stroke | 140mm |
| Object Size | 4inch |
| Object Material | Wafer |
| Dip Speed | from 0.1 mm/sec. to 10 mm/sec |
| Circulation Device of Coating Liquid | Not Equipped |
| Temperature Control of Coating Liquid | Not Equipped |
| Filter Mesh | Not Equipped |
| Drying Device | Not Equipped |
| Dry Temperature | Not Equipped |
| HEPA (High Efficiency Particulate Air Filter) Unit | Not Equipped |
| Equipment Dimension (mm) [approximate] | W:450 D:670 H:685mm |
